הכנס השנתי לזיווד אלקטרוני, אלקטרומכאניקה והדפסה תלת מימד

The annual Electronic Packaging, Electro–Mechanical Solutions & 3D Printing, 2022 Conference and Trade Fair will deal with providing various solutions for electronic system packaging, will present innovations and solutions for connecting mother boards, environmentally friendly innovations and solutions for server farm racks, packaging for vehicles, commercial and military packaging, racks and cabins for communication applications and for special environmental conditions, packaging materials, fasteners, solutions for heat removal and cooling in racks and packages, industrial designing, content tools, simulation, analysis and environmental test innovations, machining of metal and plastic parts, standardization services and more. Senior lecturers from the industry and the academy, as well as guest lecturers from around the world, will take part in the conference giving lectures and presenting innovations in the packaging field, innovations in the material, coating and coloring fields, packaging solutions for special applications, production and speed modelling technologies, heat removal and cooling, electromagnetic compliance, RFI, EMC and EMI and more.